| PART |
Description |
Maker |
| M24.173B |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP) 薄小外形Wxposed垫塑料封装（EPTSSOP
From old datasheet system
|
INTERSIL[Intersil Corporation]
|
| SBR130S3 |
SBR® Super Barrier Rectifiers: Small Outline Packages
|
List of Unclassifed Manufacturers
Dionics Inc.
|
| FPT-20P-M04 |
THIN SHRINK SMALL OUTLINE PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| AK18D300-TSOP AK14D300-TSOP AK20D300-TSOP |
Thin Small Outline Package TSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| 21-0181 |
PACKAGE OUTLINE, 43L THIN QFN, 3.5*9*0.8MM
|
Maxim Integrated Products
|
| HYM328000GD-60 HYM328000GD- 328000 HYM328000GD-50 |
-8M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
8M x 32 Bit DRAM Module (SO-DIMM)
From old datasheet system
8M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 8M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
|
Siemens Semiconductor G...
Infineon
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
|
| SES3V3D923-2U |
Small Body Outline Dimensions
|
Surge Components
|
| FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| MT8LSDT1664 MT8LSDT1664H MT8LSDT1664HG-10C MT8LSDT |
SMALL-OUTLINE SDRAM MODULE
|
MICRON[Micron Technology]
|
| PM-1010 PM-1011 PM-1012 PM-1013 PM-1014 PM-1015 PM |
SMALL OUTLINE 10/100BASE-T ISOLATION TRANSFORMERS
|
Premier Magnetics, Inc.
|
